First mobile in-ear headphones with microchip speakers at DAGA 2019

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The Fraunhofer Institute for Digital Media Technology IDMT and the Fraunhofer Institute for Silicon Technology ISIT are presenting the first battery-powered version of an in-ear headphone with MEMS loudspeaker technology at the 45th Annual Meeting of the German Society for Acoustics (DAGA) in Rostock from 18 to 21 March. Thanks to this research success, the headphones are now ready for mobile use.

In-ear headphone with microchip speaker
In-ear headphone with microchip speaker

A year ago, the first prototype of a powerful and fully integrated in-ear headphone with MEMS loudspeaker technology was presented at the DAGA in Munich. In addition to the development of a battery-operated version, the sound and loudness were also optimized.

At the DAGA in Rostock, visitors can experience the mobile headphones at booth no. 7 and learn about the current developments regarding construction and control of MEMS loudspeakers. MEMS stands for microelectromechanical systems and combines classic semiconductor technology with miniature mechanics in the micrometer range.

With a current size of 4 x 4 millimeters, the miniature loudspeakers cover the complete frequency range from 20 Hz to 20 kHz with a single transducer and achieve a remarkable sound pressure level of 110 dB for in-ear applications.

MEMS loudspeakers are a serious competitor to classic headphone loudspeaker systems 

"The intelligence lies in the control of these tiny electroacoustic systems," explains Daniel Beer. "We have worked intensively on optimizing the sound characteristics. And the results show that MEMS loudspeakers are a serious competitor to classic headphone loudspeaker systems. The advantages of the small chip-based loudspeakers: they can be manufactured readily and cost-efficiently from silicon, like computer chips, and fit into the smallest spaces. This also makes them attractive for use in hearing aids, hearables and smartphones.

The next milestone in the Fraunhofer researchers' development is to combine the electronic control system and the MEMS loudspeaker chip in a compact assembly.

In a special poster presentation, DAGA 2019 visitors will also learn more about the challenge of achieving even better sound with ever smaller loudspeaker dimensions. (20.3.2019, Room 1, 11.20 a.m., Title: "Sound propagation in small structures in relation to MEMS loudspeakers")

Fraunhofer IDMT will be represented at DAGA 2019 with further scientific contributions. For example, acoustics expert Christoph Sladeczek and his team will present the success story of object-based 3D audio for two cruise ships of TUI Cruises GmbH. (20.3.2019, Room 7, 15.40 pm)

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