San Francisco, USA  /  August 27, 2019  -  August 29, 2019

2019 AES International Conference on Headphone Technology

Meet our expert for loudspeaker development, Dr. Daniel Beer, head of the Electroacoustics Group at Fraunhofer IDMT. In his keynote speech on "Acoustic and Design with MEMS drivers" you will learn more about the basics of MEMS technology and its application in loudspeaker manufacturing:

"There is a high demand for portable sound on the market. Manufactures of headphones, hearing aids, and smartphones have to deal with miniaturization of electroacoustic transducer (micro speakers) size by keeping sound quality and energy efficiency (battery life time) at the same time. Different techniques are known to downsizing transducers. A very successful method is given by the semiconductor industry. The use of the so-called MEMS technology (Micro-Electro-Mechanical-System) leads to great success in applications for microphones and accelerometers. This success has triggered a high interest in the potential of MEMS technology for speaker manufacturing. The keynote speech explains basics of MEMS technology. Based on patents, the initial approaches of MEMS loudspeakers will be presented. Finally, some notes will be given for particularities in very small acoustic systems."

Convince yourself on site of the innovative technology!

Together with Fraunhofer ISIT, we will present our latest results in the development of MEMS loudspeakers as part of a demonstration: a new piezo speaker for in-ear headphone systems based on MEMS technology. Experience the potential of this MEMS based speaker by listening to music with an in-ear headphone system. With its core advantages – high-fidelity audio reproduction, low power consumption and outstanding fabrication accuracy in cost-efficient volume production – this MEMS speaker offers a promising approach to fulfill the audio requirements of future mobile devices, such as headphones or hearable systems.

  • August 27, 2019, 14.45.p.m. – 16.15 p.m. CET